this is information on a product in full production. may 2014 docid023193 rev 2 1/10 DIP2450-01D3 2 g / 5 g wlan diplexer datasheet - production data figure 1. pin configuration (bump view) features ? low insertion loss in pass band ? high attenuation levels ? high rejection of out-of-band frequencies ? small footprint: < 1.4 mm 2 benefits ? very low profile (<600 m after reflow) ? high q, low loss ? high rf performance ? tight tolerance ? bill of materials and area reduction applications ? wlan ? bluetooth ? mobile phone application ? wireless networking description this diplexer targets the use of dual band 2.4 ghz and 5 ghz. the DIP2450-01D3 is a diplexer dedicated to the wlan/bt application. it is designed using stmicroelectronics ipd (integrated passive device) technology on non conductive glass substrate to optimize rf performance. flip chip package 4 bumps a b 1 2 2g 5g ant gnd www.st.com
characteristics DIP2450-01D3 2/10 docid023193 rev 2 1 characteristics table 1. a bsolute rating (limiting values) symbol parameter value unit min. typ. max. p av average power 27 dbm v esd antenna and 2g ports esd ratings: mil std883c (hbm:c = 100 pf, r = 1.5 k , air discharge) charged device model (cdm) machine model (mm: c = 200 pf, r = 25 , l = 500 nh) 400 500 100 v t op operating temperature range -40 +85 oc table 2. electrical characteristics and rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. pass band f 2 g band pass 2400 2483.5 mhz 5 g band pass 4900 5850 mhz z nominal impedance 50 return loss all ports -17 db s21 2 g to antenna insertion loss 2400 to 2483.5 mhz 0.6 0.7 db s31 5 g to antenna insertion loss 4900 to 5850 mhz 0.6 0.7 db attenuation s21 2 g to antenna attenuation 4900 to 5850 mhz 20 db s31 5 g to antenna attenuation 2400 to 2483.5 mhz 18 db out of band attenuation s21 2 g to antenna attenuation 5850 to 7000 mhz 15 db 7000 to 9500 mhz 9 9800 to 10500 mhz 16 s31 5 g to antenna attenuation 9800 to 11650 mhz 11 db
docid023193 rev 2 3/10 DIP2450-01D3 characteristics 10 1.1 measured performance figure 2. 2 g and 5 g forward transmission (t amb = 25 c) figure 3. 2 g, 5 g and antenna reflection coefficient (t amb = 25 c) f (ghz) s21 and s31 (db) s21 (2 g ant) s31 (5 g ant) 02468 10 12 0 -10 -20 -30 -40 -50 -60 s11, s22 and s33 (db) s11 (ant) s22 (2 g) s33 (5 g) 02468 10 12 0 -5 -10 -15 -20 -25 -30 f (ghz) -35 figure 4. 2 g insertion loss (t amb = 25 c) figure 5. 2 g attenuation in 5 g band (t amb = 25 c) s21(db) 2.40 2.42 2.44 2.46 2.48 2.50 -0.40 -0.45 -0.50 -0.55 -0.60 -0.65 -0.70 f (ghz) s21(db) 4.9 5.1 5.3 5.5 5.7 5.9 -10 -20 -30 -40 -50 -60 -70 f (ghz) figure 6. 2 g attenuation in high frequency band (t amb = 25 c) figure 7. 2 g return loss (t amb = 25 c) s21(db) 5 678 9 10 12 -0 -10 -20 -30 -40 -50 -60 f (ghz) 11 s22(db) 2.40 2.42 2.44 2.46 2.48 2.50 -10 -15 -20 -25 -30 f (ghz)
characteristics DIP2450-01D3 4/10 docid023193 rev 2 figure 8. antenna return loss in 2 g band (t amb = 25 c) figure 9. antenna return loss in 5 g band (t amb = 25 c) s11(db) 2.40 2.42 2.44 2.46 2.48 2.50 -10 -15 -20 -25 -30 f (ghz) s11(db) -10 -15 -20 -25 -30 f (ghz) 4.9 5.1 5.3 5.5 5.7 5.9 figure 10. 5 g insertion loss (t amb = 25 c) figure 11. 5 g attenuation in 2 g band (t amb = 25 c) s31(db) -0.40 -0.45 -0.50 -0.55 -0.60 -0.65 -0.70 f (ghz) 4.9 5.1 5.3 5.5 5.7 5.9 s31(db) 2.40 2.42 2.44 2.46 2.48 2.50 f (ghz) -10 -20 -30 -40 -50 -60 -70 figure 12. 5 g attenuation in high frequency band (t amb = 25 c) figure 13. 5 g return loss (t amb = 25 c) s31(db) 5 678 9 10 12 -0 -10 -20 -30 -40 -50 -60 f (ghz) 11 s33(db) -10 -15 -20 -25 -30 f (ghz) 4.9 5.1 5.3 5.5 5.7 5.9
docid023193 rev 2 5/10 DIP2450-01D3 characteristics 10 figure 16. 2 g to 5 g isolation in 5 g band (t amb = 25 c) figure 14. 2 g to 5 g isolation (t amb = 25 c) figure 15. 2 g to 5 g isolation in 2 g band (t amb = 25 c) f (ghz) s23 (db) 02468 10 12 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 s23(db) 2.40 2.42 2.44 2.46 2.48 2.50 f (ghz) -15 -20 -25 -30 -25 -40 s23(db) f (ghz) 4.9 5.1 5.3 5.5 5.7 5.9 -15 -20 -25 -30 -25 -40
application information DIP2450-01D3 6/10 docid023193 rev 2 2 application information figure 17. application schematic figure 18. pcb recommendation 2ghz rx 5ghz rx 2ghz tx 5ghz tx bt balun bt rx bt tx wlan diplexer 2g 5g ant pad diameter: 220 m, distance from ground: 100 m
docid023193 rev 2 7/10 DIP2450-01D3 package information 10 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 19. package dimensions figure 20. footprint figure 21. marking 2g 5g ant gnd 725 m 625 m 1.1 mm 50 m 1.25 mm 50 m 630 m 60 m 200 m ?255 m 40 m 187.5 m 187.5 m 187.5 m 437.5 m copper pad diameter: 220 m recommended solder stencil opening: 220 m recommended solder mask opening: 300 m minimum 260 m maximum x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week)
package information DIP2450-01D3 8/10 docid023193 rev 2 figure 22. flip chip tape and reel specifications user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 +0.3 -0.10 4.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.50 0.10 0.71 0.05 1.20 0.05 0.20 0.02 1.35 0.05
docid023193 rev 2 9/10 DIP2450-01D3 ordering information 10 4 ordering information 5 revision history . table 3. ordering information order code marking package weight base qty delivery mode DIP2450-01D3 sa flip chip 1.88 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 27-june-2012 1 initial release 07-may-2014 2 updated figure 19: package dimensions .
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